000			004020000a22001570004500
245			_aFLIP chip technologies
100			_aLav, John H., ed.
260			_aNew York _bMcGraw Hill _c1996
300			_a565 p., ill.
440			_aElectronic packaging and interconnection series
020			_a0-07-036609-8
080			_a621.3.049.77 _bF4
650			_aMICROELECTRONICS
041			_aEN
942			_cBK
999			_c68144 _d68144