000 | 005360000a22001690004500 | ||
---|---|---|---|
245 | _aRapid thermal processing for future semiconductor devices | ||
700 | _aFukuda, Hisashi ed. | ||
111 | _aINTERNATIONAL CONFERENCE ON RAPID THERMAL PROCESSING FOR FUTURE SEMICONDUCTOR DEVICES (2001 : Ise-Shima, Mie) | ||
260 |
_aAmsterdam _bElsevier _c2003 |
||
300 | _ax, 150p. : ill. | ||
020 | _a0444513396 | ||
080 |
_a621.315.5 _bI6 |
||
650 | _aSEMICONDUCTOR DEVICES | ||
650 | _aThermal Effects | ||
041 | _aEN | ||
942 | _cCP | ||
999 |
_c26066 _d26066 |