TY  - GEN
AU  - Fukuda, Hisashi ed.
ED  - INTERNATIONAL CONFERENCE ON RAPID THERMAL PROCESSING FOR FUTURE SEMICONDUCTOR DEVICES (2001 : Ise-Shima, Mie)
TI  - Rapid thermal processing for future semiconductor devices
SN  - 0444513396
PY  - 2003///
CY  - Amsterdam
PB  - Elsevier
KW  - SEMICONDUCTOR DEVICES
KW  - Thermal Effects
ER  -