Rapid thermal processing for future semiconductor devices (Record no. 26066)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 005360000a22001690004500 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 0444513396 |
| 080 ## - UNIVERSAL DECIMAL CLASSIFICATION NUMBER | |
| Universal Decimal Classification number | 621.315.5 |
| Item number | I6 |
| 041 ## - LANGUAGE CODE | |
| Language code of text/sound track or separate title | EN |
| 111 ## - MAIN ENTRY--MEETING NAME | |
| Meeting name or jurisdiction name as entry element | INTERNATIONAL CONFERENCE ON RAPID THERMAL PROCESSING FOR FUTURE SEMICONDUCTOR DEVICES (2001 : Ise-Shima, Mie) |
| 245 ## - TITLE STATEMENT | |
| Title | Rapid thermal processing for future semiconductor devices |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) | |
| Place of publication, distribution, etc. | Amsterdam |
| Name of publisher, distributor, etc. | Elsevier |
| Date of publication, distribution, etc. | 2003 |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | x, 150p. : ill. |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | SEMICONDUCTOR DEVICES |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Thermal Effects |
| 700 ## - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Fukuda, Hisashi ed. |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | Conference Proceeding |
| Withdrawn status | Lost status | Source of classification or shelving scheme | Damaged status | Not for loan | Permanent Location | Current Location | Shelving location | Date acquired | Full call number | Barcode | Date last seen | Price effective from | Koha item type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Not For Loan | Library, University of Moratuwa | Library, University of Moratuwa | On Request Collection | 20/01/2014 | 621.315.5 I6 | 84948 | 24/06/2019 | 20/01/2014 | Conference Proceeding |